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Film on Metal Leaded Chip Carrier Disclosure Number: IPCOM000057573D
Original Publication Date: 1988-Jun-01
Included in the Prior Art Database: 2005-Feb-15

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Dietsch, HE Nestork, WJ [+details]


A surface mountable package with optimized electrical and thermal characteristics for high performance VLSI chips is described. With increasing levels of integration of circuitry on semiconductor chips, chip sizes are also becoming larger. Larger chip sizes present a problem for the most efficient chip-to-substrate peripheral lead/tin (Pb/Sn) solder ball connection. This type of connection, commonly mounted to aluminum oxide (Al2O3) substrates, experiences increased shear forces caused by a mismatch of the thermal expansion coefficient of a semiconductor chip and substrate materials. The life expectancy of these interconnections is limited by the distance from a chip neutral point and the difference in thermal expansion coefficients.