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Direct Resistless Structuring Disclosure Number: IPCOM000057614D
Original Publication Date: 1988-Jun-01
Included in the Prior Art Database: 2005-Feb-15

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Greschner, J Schmid, G Trippel, G Wolter, O [+details]


A process is described which is suitable for structuring large areas of preferably anorganic, planar substrates, using a structured stem for in-situ application of the etchant to the regions to be etched. The process can be used for mass-produced substrates for optical plates. Example 1 It is proposed that the etchant be applied in situ to the regions to be etched. This may be readily done by means of a stem. The desired groove structure is transferred to a silicon stem photolithographically and by a dry etch step. This groove structure is a positive image of the future structure of the optical plate. The grooves in the stem are filled with buffered hydrofluoric acid for etching glass substrates.