Browse Prior Art Database

Polysulfone Sealing Frame

IP.com Disclosure Number: IPCOM000057713D
Original Publication Date: 1988-Jun-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
DiPaolo, N Fantozzi, S [+details]

Abstract

An improved sealing frame for the thermal conduction module (TCM) is described in U.S. Patent No. 4,500,945. The TCM requires a C-ring 1 between the substrate 2 and the cooling hat or cover 3 to provide an hermetic seal. To reduce localized stresses imposed by the clamping plate 4 on the pin side of the substrate, a thin gasket or sealing frame 5 is provided. For better back up cushioning to the substrate, the sealing frame 5 is made from polysulfone. The polysulfone can better withstand the high compressive loads without cracking or losing the hermetic seal. The chemical properties of the polysulfone are also good.