Browse Prior Art Database

Cold Plate With Three Parallel Channels and Flow Restrictors in Outside Channels for Increased Cooling for Center Chips of Circuit Module

IP.com Disclosure Number: IPCOM000057796D
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Hwang, UP [+details]

Abstract

A cold plate for a circuit module, such as a thermal conduction module (TCM), has a water inlet connection and a water outlet connection at two laterally opposite corners, for example, the upper left and lower left corners as seen in a top view in which the channels of the cold plate overlie an approximately square array of semiconductor chips. From the inlet, a serial channel makes several passes across the bottom row or bottom few rows of chips. A similar serial channel at the outlet covers the top row or top few rows of chips. Three folded channel branches are connected between the uppermost channel length at the inlet and the lowermost single channel length at the outlet. The two outside branches overlie the outermost column or outermost few columns of chips.