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Thermal Conduction Module With Detachable Cold Plate Having Selectively Plated Thermally Conductive Pad Offsetting Camber in Contacting Surfaces

IP.com Disclosure Number: IPCOM000057802D
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Hwang, UP Ing, PW [+details]

Abstract

In a circuit module called the TCM (thermal conduction module), a planar substrate carries an array of a hundred or so semiconductor chips. Commonly, the center of the array has high-powered logic circuits and the edges of the array have lower-powered circuits that exchange signals with other modules. The module has a structure called a hat that conducts heat from the chips. A water-cooled cold plate is attached to the hat. During manufacture, the matching surfaces of the hat and the cold plate are made smooth. Ideally, the surfaces would be oppositely concave and convex to produce the best thermal contact in the center of the module where the greatest heat transfer takes place. In fact, both surfaces are slightly concave.