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Location-Specific Electroplating Using a Patterned Plating Base

IP.com Disclosure Number: IPCOM000057819D
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Seeger, DE [+details]

Abstract

A technique is described whereby high resolution structures, such as used in X-ray mask patterning in the fabrication of semiconductors, are electroplated in a pattern defined by the specific location of the plating base (PB). This is done so as to circumvent contamination and/or damage to the plating base materials. Described is a method of patterning the PB by selective removal of the PB in undesired areas after blanket deposition of the PB. The process has potential applications in X-ray mask patterning or any compatible electroplating process. Prior-art plating processes typically involve deposition of a PB before formation of a resist stencil mask. The six steps used in the prior art electroplating process are shown in Fig. 1. Contamination or damage of the PB can occur during the resist processing step.