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High Density Chip Carrier With Protected Leads

IP.com Disclosure Number: IPCOM000057839D
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Overfield, RB Singh, P Spalik, JT [+details]

Abstract

An improved method of reducing deformation of surface mounted components is described. The method provides protection to fragile leads of SMT components during high density packaging operations. Some chip leads are fragile and bend very easily, causing scrap and rework. Leadless Chip Carriers (LCCs) have high stress solder joints. Plastic Leaded Chip Carrier (PLCC) solder joints are rigid and are also difficult to inspect. There are three areas that need to be integrated for a reliable method: 1) compliant leads to withstand stress, 2) protected leads to provide easy handling in manufacturing, and 3) easy solder joint visibility for enabling visual inspection. This method addresses all of these areas.