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Interferometer Head for Contactless Chip Testing Disclosure Number: IPCOM000057851D
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15

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Beha, JG Jaeckel, H [+details]


The proposed integrated interferometer head allows high-speed Charge Density Probe (CDP) waveform measurements and is suited for the contactless, simultaneous analysis of multiple input/output signals appearing at the pads of a chip under investigation. Fig. 1 shows the design of a suitable chip pad and the probe-(P) and reference-(R) beams used for the CDP waveform measurement. One section (A) of the metal pad, arranged at the bottom side of the chip, is connected to a pn-junction, as shown, whereas the other sections (B) of the pad are separated from the chip by an insulation layer.