Automated Chip, Decal and Lead Frame Lamination Method
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15
This is a semiconductor chip mounting technique wherein operations to form appropriately shaped polyimide decals, bond the decals to lead frame assemblies, align, mechanically bond and electrically connect semiconductor chips to the lead frame assemblies are performed in a continuous serialized fashion with the use of release tape carrier strips. The three figures each portray a top view and a cross-section of the assembly at three points in the automated process. In Fig. 1, polyimide 2, with adhesive on both sides, is carried on release tape carrier strip S while the polyimide 2 is cut along its length and a central strip of the polyimide, with its adhesive layers, is removed by a skiving operation.