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Thin-Film Head Process Technology for High Recording Density

IP.com Disclosure Number: IPCOM000057954D
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Glatzel, FGM Grube, HH [+details]

Abstract

During the manufacture of magnetic thin-film heads, a high magnetic DC field is used for all process steps in which temperature and/or stress effects of any kind may influence the magnetic domain structure of the thin-film element. The DC field is oriented parallel to the desired easy axis in the thin-film element. Such processing leads to improved domain switching properties and eliminates head-related hard errors. The strong magnetic DC field of, say, 500 Oersted and more, is applied to the wafer surface in a direction identical to that of the inducing field in the permalloy plating processes. The steps effected by and under control of this strong magnetic DC field are, for example, as follows.