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Testable High Performance Module

IP.com Disclosure Number: IPCOM000057993D
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Katyl, RH Woychik, CG [+details]

Abstract

A chip carrier package uses an injection molded pin carrier/heat sink assembly with a thin film interconnect. This package integrates several features including a heat sink, capacitors on the thin film, and top-side pins for testing, to provide an improved model having efficient heat removal and testing pins available for electrical testing at the card level. The package is described in the following. A pin carrier 1 (Fig. 1) holds the pins 2 in an injection molded assembly. Prior to the molding operation the pins 2 are placed in the mold along with a metal heat spreader insert 3 which will later provide a thermal contact to the removable heat sink 4. For topside pin access the top of the pins 2 are recessed in holes at the top side of the carrier.