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Flexible Heat Sink

IP.com Disclosure Number: IPCOM000058000D
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Carden, TF Cerny, MT Funari, J Smey, SL [+details]

Abstract

Ceramic chips used on flexible circuits, e.g., thin film polyimide with controlled collapse chip connector (C-4) technology, that require heat sinks, reduce the flexibility and life expectancy of the solder joints. A described flexible heat sink removes the heat without detracting from the flexibility of the circuit. The heatsink is constructed and works as described in the following. A braided wire such as that commonly used as a ground strap can serve as a heatsink. The wire is attached to a flex cable using an epoxy adhesive. The thickness of the wire can be varied to meet the cooling requirements.