Browse Prior Art Database

Flexible Heat Sink Disclosure Number: IPCOM000058000D
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue


Related People

Carden, TF Cerny, MT Funari, J Smey, SL [+details]


Ceramic chips used on flexible circuits, e.g., thin film polyimide with controlled collapse chip connector (C-4) technology, that require heat sinks, reduce the flexibility and life expectancy of the solder joints. A described flexible heat sink removes the heat without detracting from the flexibility of the circuit. The heatsink is constructed and works as described in the following. A braided wire such as that commonly used as a ground strap can serve as a heatsink. The wire is attached to a flex cable using an epoxy adhesive. The thickness of the wire can be varied to meet the cooling requirements.