Flexible Heat Sink
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-15
Ceramic chips used on flexible circuits, e.g., thin film polyimide with controlled collapse chip connector (C-4) technology, that require heat sinks, reduce the flexibility and life expectancy of the solder joints. A described flexible heat sink removes the heat without detracting from the flexibility of the circuit. The heatsink is constructed and works as described in the following. A braided wire such as that commonly used as a ground strap can serve as a heatsink. The wire is attached to a flex cable using an epoxy adhesive. The thickness of the wire can be varied to meet the cooling requirements.