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Double-Conical Shield Arrangement for Wider Process Windows And/Or Larger Diameter Substrates in Static High-Rate Reactive Sputter Deposition Systems

IP.com Disclosure Number: IPCOM000058010D
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Jones, F Owens, B [+details]

Abstract

High-rate reactive sputter deposition is used to deposit oxide films with uniform thickness on large diameter (125 mm) substrates. The sputter deposition system includes a large diameter magnetron, an oxygen concentrator and a conical shield. The elements are arranged so as to not obstruct the flow of material from the target to the substrate. In a modification of the sputter deposition system, a double- conical shield is used to obtain a wider process window. (Image Omitted) In Fig. 1 a system is shown for reactively sputtering deposit compounds for ZrO2 . The target 10 is Zr. A magnetron 12 is disposed at the top of a vacuum chamber 14. An RF generator provides RF power along conductor 16. The substrate 18 is disposed in an oxygen gas concentrator 20.