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Adhesion Test

IP.com Disclosure Number: IPCOM000058035D
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Gaudin, P [+details]

Abstract

The purpose of this test is to study, after adhesion treatments, the shape of different patterns versus different priming (adhesion) time. This test permits evaluating and performing the prime process on new vacuum prime modules. (Image Omitted) The operating conditions are the following: -After priming, the wafers are coated with resist and baked, -The wafers are exposed on stepper tool with resolution mask, -The wafers are controlled on a great number of sites (in the range of 50-100), and there are, for example, 4 patterns on each site, and -The deduction of adhesion percentage with the exploitation of results. The photographs show, respectively, the shape of the patterns depending on bad adhesion (A) or good adhesion (B). In the latter case, some patterns are missing.