Browse Prior Art Database

Low-Cost, High-Power, Multi-Chip Module Design

IP.com Disclosure Number: IPCOM000058096D
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Jen, TS Weiss, RL [+details]

Abstract

A method of interconnecting multiple electronic chips on a substrate with flexible circuitry provides improved cooling capacity as well as signal and power distribution. The design is described in the following. As shown in the drawing, a chip 1 is solder mounted on copper clad INVAR* 2, which is, in turn, solder mounted to a cap 3 attached to a cold plate 4. The chip 1 is attached on its circuit side to a flexible film 5 which has circuitry on two sides. The circuitry on the film 5 connects to the module 6. The chip 1 is attached to the film using controlled collapse chip carrier (C-4) technology. Heat generated by the chip 1 is dissipated through the copper clad INVAR 2 to the cap 3 to the cold plate 4.