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Method of Improving the Adhesion of a Dielectric Material With Fine Line Circuitry to Metal Substrates

IP.com Disclosure Number: IPCOM000058106D
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Miersch, EF Schaefer, R [+details]

Abstract

To improve the adhesion of a dielectric material, such as a polymer, with fine line circuitry to a metal substrate, the following steps are applied: 1. Wet etch a copper foil laminated to a carrier 1 of, say, a polymer or metal, etc. 2. Bond copper lines 2 thus obtained to both sides of an INVAR* foil 3 by known techniques, such as silver-filled epoxy or polyimide, eutectic or solder bonding - Au/Sn, Pb/Sn. 3. Remove carriers 1 by etching or ashing the polymer or mechanically by tearing them off. 4. Apply an adhesion promoter. (Image Omitted) 5.