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Tape Automated Bonding Cooling Protector Disclosure Number: IPCOM000058197D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue


Related People

Buller, L Ekstrom, GA Perkins, CT [+details]


A protector device is described which provides cooling for a tape automated bonding (TAB) device, protection of the tab leads, and prevents shock and vibration damage. TAB packages surface soldered to printed circuit carriers have a large number of fine pitched leads around the periphery of the chip. These leads can easily be damaged through handling and processing of the assembled carriers. This protector device offers protection of those leads. TAB packages must dissipate the heat generated by the chip. As power increases, cooling capacity must increase in direct proportion. This protector device provides low and high power versions for transferring the heat from the chip and dissipating it.