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Circuitry Device for Dense First and Second Level Packaging

IP.com Disclosure Number: IPCOM000058210D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Bhatt, AG Doran, DE Hunsinger, LE [+details]

Abstract

The stacking of alternating layers of copper foil and dielectric sheets which are then bonded together, cut into thin layers and reconfigured, provides a method for increasing packaging density in the construction of a multi-level circuitry device. The device is constructed in the following fashion. As seen in Fig. 1 copper foil sheets 1 and dielectric sheets 2 are stacked in alternating layers. The dielectric sheets 2 are made with resin (typically, epoxy, polyimide, etc.) intermixed with non-continuous glass filament and fully cured. The copper foil 1 is coated on both sides with a partially cured resin 3. The resin 3 is fully cured when copper foil 1 is bonded to the dielectric 2.