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Tape Automated Bonding/Pin Grid Array Package Disclosure Number: IPCOM000058223D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-15

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Beaman, BS [+details]


This article describes an improvement over presently used metallized ceramic substrate packages which eliminates existing chipping and cracking problems associated with the employment of ceramic base plates. The described tape automated bonding/pin grid array (TAB/PGA) package replaces the ceramic base plate with a plastic one employing a matrix of stake pins. It also enables multiple tape automated bonding (TAB) circuit assemblies to be combined into a multi-chip module. The TAB/PGA package is a first level integrated circuit package whose unique features derive from the joining of tape automated bonding processes (and materials) with a thermally enhanced pin grid array package.