Thermally Enhanced Tape Automated Bonded Package
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-15
This article describes a tape automated bonded (TAB) package which employs a metal heat sink and a thermal grease interface between the chip and the heat sink to improve TAB package cooling. The cooling capability of some TAB packages in personal computer products is limited to .7W maximum. As the number of I/O devices increase so does the chip power. It will be necessary in future PC products to cool 2.5W in a very large-scale integration (VLSI) chip. The TAB package disclosed herein employs a metal heat sink and a thermal grease interface between the chip and heat sink to improve TAB package cooling. The thermal grease conducts heat from the chip to the heat sink and also spreads heat from the small chip area to a large heat sink internal surface. The heat sink is bonded or mechanically fastened to a circuit board.