Browse Prior Art Database

Chip Sorting Buffer Mechanism for Chip Mounting Machine

IP.com Disclosure Number: IPCOM000058356D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Shiota, Y [+details]

Abstract

In this technique, chips are mounted on a lead frame directly from a wafer at the mounting station. The chip sorting buffer mechanism enables chips of the same class or characteristic to be mounted on each lead frame even if the wafer at the mounting station does not have enough chips of the same class to fill a lead frame. Odd chips are temporarily kept at a buffer area until additional chips of the same class become available from a different wafer subsequently fed to the mounting station. Each lead frame has a given number of chip mount sites. To facilitate handling after chip mounting and increase manufacturing efficiency, it is desirable to mount the chips on the lead frame directly from a wafer and fill all of the given number of chip mount sites of the lead frame with chips of the same characteristic or quality.