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Tape Automated Bonding Package Enhancements

IP.com Disclosure Number: IPCOM000058388D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Snyder, CH [+details]

Abstract

A method of providing simultaneous electrical and thermal enhancement and mechanical protection for Tape Automated Bonding (TAB) devices is described. This method is illustrated in Figs. 1 and 2, which show a multilayer cover attached over TAB devices. The cover is composed of two layers: 1. An electrically insulating layer next to the IC and TAB leads, and 2. An electrically and thermally conductive layer above the insulating layer, electrically connected to ground. Layer 1 should have good thermal conduction properties, but its primary purpose is electrical insulation. The cover extends beyond the TAB outerlead bonds, where it is attached to the substrate (e.g., circuit card) upon which the TAB device is mounted. This cover provides: 1.