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Precatalyzed Epoxy Formulations for Electroless Plating

IP.com Disclosure Number: IPCOM000058430D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Appleby-Houghham, G Feger, C Feilchenfeld, N Park, JM Sambucetti, C [+details]

Abstract

Precatalyzed epoxy formulations are described which contain organometallic complexes as the precursor of seeds for electroless plating of copper circuitry for the manufacturing of advanced circuit boards. These formulations are compatible with any kind of photoresist as well as a permanent photoresist. One of the possible seeding processes using a permanent resist in manufacturing advanced circuit boards uses catalytic laminates. A catalytic laminate is a reinforced composite in which the seed for electroless plating is mixed in the resin before impregnation. The fully-cured catalytic laminate is laminated with photoresist and patterned. After suitable activation steps, the seed on the circuit channel floor is exposed to the surface and is ready for additive plating.