Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-15
A flux-dispensing tool head is described in this article which eliminates excess flux dripping on substrate surfaces after dispensing. Designed to interface with existing module placement to substrate tooling, the disclosed tool allows the automatic dispensing of preset quantities of flux on C4 (controlled-collapse chip connection) pads prior to chip placement and joining. The figure presents a cross-sectional view of the disclosed pneumatic and vacuum-actuated flux-dispensing tool head. A stainless- steel wire cloth (mesh) surface 1 is incorporated in the tip 2 of the dispensing tube. Various-sized tips may also be used in the tool to accommodate differing module solder pad sizes.