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Improved Interconnection Structure Disclosure Number: IPCOM000058481D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-15

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Related People

Karner, FA Stadler, EE [+details]


Proposed is a reliable electrical loop direct attach technology system (RELDATS) packaging concept using a wire loop to electrically interconnect component members or substrates 1, 2 (Fig. 1) and large I/O matrices. The pins normally used are replaced in this system by thin wire loops 3. In an array replacing, for example, a large pin grid array, the wire loops are preferably rotated by 90 degrees relative to each other, yielding a regular pattern, as shown in Fig. 2, which is a plan view of the projection of such a loop array. The wire loops are used as a connector or surface solder interface between two packaging members, such as module and card, which are to be connected electrically and mechanically.