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Compliant Lead Reform Tool and Process Disclosure Number: IPCOM000058533D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-15

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Darrow, R Larnerd, J Roody, R Yelle, N [+details]


This arrangement provides an improved tool and process for reforming substrate I/O leads to make them compliant for surface mount application. Surface mount technology assumes a direct mounting of components to the surface of a PC card without the component leads passing through and being soldered to plated-through holes. As a result, the solder joint between the component lead and the PC card is subjected to severe mechanical stress due to the difference in coefficient of thermal expansion between the card and the ceramic component. To overcome this problem and to prevent the solder joint from cracking, the leads 1, 1 between the component 2 and the card 3 are reformed into a serpentine configuration, as shown in Fig. 1, thereby providing a stress relief due to the compliant configuration.