Equal Force Planarity Device
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-15
An embodiment for an equal force device (Fig. 1) is used to assure uniform force distribution for simultaneous bonding of beam leads 1 to contact pads 2 on a substrate 3, e.g., a semiconductor chip or packaging substrate. The substrate 3 is placed in a well 4 in a substantially rigid member 5 which rests on a flexible member 6 which rests in rigid container 7. Substrate 3 can rest directly on flexible member 6. Flexible member 6 can be a fluid-filled flexible container, e.g., formed from a plastic or polyimide membrane filled with air or a liquid. Flexible member 6 can be a continuous flexible member. Bonding head 8 presses the ends of beam leads 1 against contact pads 2.