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Edge Contactless Wafer Orientor Disclosure Number: IPCOM000058559D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-15

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Brandorff, A Gardineer, B Peruffo, NJ Steege, P Wilman, JG [+details]


An electromechanical device has been developed for orienting semiconductor wafers by only contacting their backsides, thereby reducing possible contamination. The mechanism uses optical sensors, software and hardware algorithms, and linear and rotary actuators to center and orient the wafers. In automatic processing of a wafer, it is necessary to center it, locate the notch, and then rotate it to a specific final position so as to interface with automatic tooling. When this is performed with conventional mechanical techniques, the wafer edge is subject to chipping, as is any photoresist on the wafer. Any resultant debris will result in contamination of the wafer.. (Image Omitted) The proposed contactless wafer orientor functions so as to only contact the bottom surface of the wafer.