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Electrostatic Discharge Attachment for Wafer Batch Transfer Tool

IP.com Disclosure Number: IPCOM000058561D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Kopecky, HR Peabody, DL [+details]

Abstract

A modification has been proposed for an automatic wafer transfer tool used in semiconductor manufacturing operations. The change prevents electrostatic charge buildup in the plastic carrier from adversely affecting the operation of the transfer tool, improving throughput and productivity, and avoiding wafer contamination. (Image Omitted) During the manufacturing, a wafer batch transfer tool (Fig. 1) transfers 25-125 mm wafers from a fully-loaded 25-slot wafer carrier to a quartz boat used for a diffusion step. An electrostatic charge build-up in the plastic carrier and retainer causes the end wafer to shift due to the electrostatic charge attraction (Fig. 2). This causes the transfer tool to hang up or results in broken wafers. The modification calls for a stainless steel retainer (Fig.