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Stub, Socket Module Connector Disclosure Number: IPCOM000058565D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue


Related People

Ehrenberg, SG Ludlow, PJ Pittler, MS [+details]


Disclosed is a high density, low cost semiconductor module connected to a printed circuit board interconnection system. The interconnection system disclosed herein involves the use of an interface board interposed between the module and the printed circuit board. The interface board is preferably made of the same material (same coefficient of expansion) as the module. As shown in Fig. 1, the interface board 1 contains a heating element 2. The interface board is attached to the next level of packaging (i.e., printed circuit board, not shown) by known means, such as soldering or by gold compression bonding. Wiring in the connector system consists of through vias 3 in a pattern corresponding to the desired module I/O connections. The top surface of the interface module 1 has stubs 4 formed over via areas 3.