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Linear Selective Pin-Plating Preparation System

IP.com Disclosure Number: IPCOM000058584D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Baker, BA Bleau, CD Gagliardi, D Gasper, A McPherson, MC Schmitt, GW Wattenbarger, H [+details]

Abstract

A technique is described whereby a plating system automatically applies, cures and inspects a plating resist to the head area of taper- headed input/output pins in preparation for plating. In the input/output (I/O) pin-plating procedure, only the shank portion of the pin is to be plated. This requires a plating resist to be applied to the heads of the I/O pins, before the plating, to prevent plating of the head area. The concept described herein provides a means of automatically applying, curing resist material and inspecting the area of the I/O pins which require no plating subsequent to the barrel-plating process. The linear selective pin-plating preparation system, as shown in the isometric view of Fig. 1, consists of three resist application stations 10, and control station 11.