Browse Prior Art Database

Interposer for TAB Thermal Control

IP.com Disclosure Number: IPCOM000058608D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Buller, L Linam, S McNelis, B Nemec, D Young, C [+details]

Abstract

The use of an interposer is proposed which facilitates heat transfer from a Tape Automated Bonding (TAB) device through the card to the back surface. The purpose of the interposer is to provide a connection from the TAB chip to a suitable heat sink. The heat sink may be of a variety of configurations. The use of the interposer allows the site responsible for the overall system the capability and flexibility to choose the heat sinking technique which satisfies their specific criteria. (Image Omitted) The interposer, shown in Fig. 1, consists of a metallic device which has a heat transfer capability (typically copper or aluminum) bonded to the back side of a printed circuit card in such a manner that it makes contact with the chip portion of the TAB package.