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Location Specific Electroplating Using a Patterned Plating Base

IP.com Disclosure Number: IPCOM000058650D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Seeger, DE [+details]

Abstract

A technique is described whereby high resolution structures, such as used in X-ray mask patterning in the fabrication of semiconductors, are electroplated in a pattern defined by the specific location of the plating base (PB). This is done so as to circumvent contamination and/or damage to the plating base materials. Described is a method of patterning the PB by selective removal of the PB in undesired areas after blanket deposition of the PB. The process has potential applications in X-ray mask patterning or any compatible electroplating process. Prior-art plating processes typically involve deposition of a PB before formation of a resist stencil mask. The six steps used in the prior-art electroplating process are shown in Fig. 1. Contamination or damage of the PB can occur during the resist processing step.