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Mounting Technique for Surface Components

IP.com Disclosure Number: IPCOM000058690D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Haining, FW Saam, CF [+details]

Abstract

Surface-mounted electrical components can be attached with less connecting area by using pointed component leads that enter and are soldered in plated blind or through holes. In Figs. 1 through 3, surface-mounted modules 1 are formed with extended, self-centering pointed leads 2 that mate with plated, shallow blind holes 3 or stepped or recessed through-holes 4 in multilayer circuit card 5. When card 5 is fabricated, holes 3 and 4 are formed and plated to connect with selected surface or buried signal lines 51-54 or power planes P1-P4 and filled with solder paste that is reflowed during component attachment. To provide for circuit rework, each plated hole 3 or 4 may have rework pad 6 connected by line 7. Discrete wires can be attached to the pad, or the pad can be isolated by severing line 7 at point 8.