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Method of Encapsulating High Voltage Components

IP.com Disclosure Number: IPCOM000058696D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Hart, LJ [+details]

Abstract

Disclosed is a method for lengthening the operating life of high voltage components that are encapsulated in an epoxy or silicon rubber. Materials used to encapsulate high voltage electronic components are subject to breakdown of their molecular structure under high voltage stresses. The encapsulating material always has some entrained gas pockets, and under voltage stress gaseous discharges can occur [1, 2]. These discharges produce reactive species that attack the insulation. Eventually, the insulation breaks down under this attack. Sulfur hexafluoride is a dense gas which is approximately three times more resistant to breakdown under voltage stress than is air [3].