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Self-Aligning, Low Adhesion Clamp-Ring Assembly

IP.com Disclosure Number: IPCOM000058717D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Conchieri, BP [+details]

Abstract

In a clamp-ring assembly to hold a semiconductor wafer in a heat sink holder for manufacturing processing, concentricity of assembled parts is assured and uniform pressure is maintained on the wafer by three compression springs on pin guides, and wafer breakage during disassembly of the holder due to adhesion between the clamp ring and the wafer is avoided by milling slots in the clamp ring. Referring to the figures, semiconductor wafer 2 is placed in a pocket of heat sink holder 4. A clamp ring 6 is brought into contact with the edge of wafer 2 by placing three equidistantly spaced holes in clamp ring 6 over pins 8 located at 120-degree intervals around the pocket in holder 4. A compression spring 10 is placed over each locating pin 8.