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Automatic Film Thickness Measuring Machine

IP.com Disclosure Number: IPCOM000058739D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Chan, SA Gasper, A Jordan, S Lisanke, MA Morgado, EJ Stewart, RA [+details]

Abstract

A technique is described whereby a machine automatically measures the film thickness of the photoresist and dielectric films on wafers, as used in the manufacture of semiconductors. The machine includes a software-controlled wafer handler and inspection station with special considerations given to ergonomics and compactness for installation in clean room environments. The automatic film thickness measuring machine is designed to measure the film thickness of photoresist and dielectric, which is deposited on the top surfaces of the wafers on the order of 100 to 4000 angstroms using a microspectrophotometer (MSP).