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Copper Peel Machine for Printed Circuit Boards

IP.com Disclosure Number: IPCOM000058741D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Gasper, A Jordan, S Morgado, EJ Perlini, JJ Stewart, RA [+details]

Abstract

A technique is described whereby a peel mechanism automatically grasps and removes excess copper foil from raw printed circuit boards prior to circuit fabrication. The mechanism includes a series of devices to locate, grasp and peel the excess copper from the printed circuit board. It is also designed to sort acceptable and reworkable products. A unique grasping jaw mechanism is incorporated with a defined travel pattern so as to provide the automatic peeling of the copper from the boards. In the fabrication of printed circuit boards, excess copper foil is required to be removed prior to the etching of circuits. Copper is laminated on either one or both sides of an insulated board material with an epoxy material and as a result of the lamination process, the board will have a wide range of tolerances.