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Apparatus for cooling memory DIMMs using extrusions, a separable hinge and a wire spring

IP.com Disclosure Number: IPCOM000058760D
Original Publication Date: 2005-Feb-15
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Abstract

This disclosure describes an apparatus for cooling memory DIMMs using extrusions and a wire spring clip. The spring clip is aligned with the air stream so that it will provide minimum obstruction of air flow.