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Automated Double-Sided Tape Shaping and Application Method

IP.com Disclosure Number: IPCOM000058779D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Bosley, R Martel, C Osborne, G Phelps, DW Starr, S [+details]

Abstract

An automated process is used to cut double-sided adhesive tape into small pieces having specific shape and to place the shaped pieces accurately on conductive pin heads of a pin grid array module. Thus, an insulating tape material is adhered to the pin heads and has a suitable adhesive on its top surface for mounting electronic devices, such as integrated circuit (IC) chips or chip carriers. Fig. 1 is a side view showing on the left side a double-sided tape (a tape with adhesive on both sides which is shown as a single layer thickness) 2 on a release liner 4 which is moved to the right and stopped under punch A, then to a position under punch B, and, finally, to a position under pressure applicator C. Dies under punches A and B and resistive support under pressure applicator C are not shown.