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Portable Sample Cleaver Disclosure Number: IPCOM000058812D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-15

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Keeley, JA [+details]


A simple and inexpensive fixture has been developed to control the cleaving of silicon wafers to facilitate sample preparation for scanning electron microscope (SEM) and thermal electron microscope (TEM) analyses. The tool consists of a thin piece of aluminum 1 on which is affixed a marking grid 2 covered by a thin sheet of plastic 3 (see the figure). Two thicker sheets of plastic 4 are attached by hinges 5 in a double-door arrangement toward the front, or top, surface of the device. The aluminum-plastic sandwich is flexible so that a force may be applied along a line where the doors abut when closed and the device is held between the thumb and forefinger of each hand and bowed. In operation, the sample to be cleaved is aligned to the underlying grid and scribed along its edges.