5-POINT CONTACT 200 mm WAFER CHUCK
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-15
A chuck has been developed for holding 200 mm semiconductor wafers during the contamination cleaning process. The 5-finger chuck holds the wafer from the edge as well as centers it while being cleaned. The proposed assembly is to be used in conjunction with a chemical brush cleaner tool. The five fingers, or clamps 1, (Fig. 1) are equidistantly spaced around the assembly and are in the open position when vacuum is applied to the piston 2. The wet or dry wafers 3 to be cleaned is positioned in the assembly making only minimal contact with the angular surface 4. When the cleaning machine is actuated, a vacuum valve closes which permits a spring 5 to push the piston 2 outward. A linkage 6 connects the clamp to the piston.