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Selective Tinning With Powdered Solder And Microwave Radiation

IP.com Disclosure Number: IPCOM000058842D
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Anderson, GE Raines, RG [+details]

Abstract

A method for controlling solder coverage and height requirements in the manufacture of circuit boards using surface mounted technology is disclosed. Current technology requires more tin and lead for connectors as surface mounted aids and for ground locators. However, solder height is only marginally controllable using state of the art techniques today.