Selective Tinning With Powdered Solder And Microwave Radiation
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-15
A method for controlling solder coverage and height requirements in the manufacture of circuit boards using surface mounted technology is disclosed. Current technology requires more tin and lead for connectors as surface mounted aids and for ground locators. However, solder height is only marginally controllable using state of the art techniques today.