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Metalization Thickness Measurement Using X-Ray Spectroscopy Techniques

IP.com Disclosure Number: IPCOM000058852D
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Simpson, DT [+details]

Abstract

Current surface profiling measurement techniques yield marginal results for very thin film metallurgies comprising, for example, successive layers of chromium (Cr), copper (Cu), and chromium (Cr). X-ray spectroscopy techniques can be used to measure the thickness of single layers of metallurgy, but the presence of a second layer, containing the same element, complicates the measurement of the thickness of this second layer because there is a contribution to the spectroscopy reading by the bottom (first) layer. In a Cr/Cu/Cr metallurgical system, this effect is masked by the intervening Cu layer, thus the spectroscopy reading for the top Cr layer is dependent upon the thickness of all three layers.