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Novel Thermosetting Resins

IP.com Disclosure Number: IPCOM000058853D
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Wang, DW [+details]

Abstract

A combination of two described chemical compositions, polyfunctional cyanate ester resins and acetylene terminated oligomers, provides a superior thermosetting resin which can eliminate disadvantages of each composition and yield a final product with excellent chemical and physical properties. This type of mixture can provide good curing characteristics and electrical properties for circuit packaging applications. It may be especially suitable for chip planarization and encapsulation operations. Other applications include: coatings, adhesives, resists, dielectric insulators and matrix resins, etc.