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Chip Site Leveling Cutter

IP.com Disclosure Number: IPCOM000058860D
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Emerick, AJ Simpson, JP [+details]

Abstract

Flush pinned metallized ceramic substrates that require surface solder to be kept at low limits, for a variety of design considerations, must have the excess solder removed when limits are exceeded during tinning. A cutting tool that removes excess solder works as follows.