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Improved C-ring for Thermal Conduction Module (TCM) And Method for Plating the Ring With a Soft Metal

IP.com Disclosure Number: IPCOM000058879D
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
O'Brien, TG [+details]

Abstract

In a TCM, a C-ring is located between an upwardly facing flange on a substrate and a downwardly facing flange on a component called a "hat". The substrate carries semiconductor chips and the associated wiring, and the hat carries components for cooling the chips. The hat and the substrate cooperate to form an enclosure for the chips, and a good seal is required between the hat and the chip carrier. A C-ring is initially circular, and in an operation that is not significant to this publication, it is reshaped to the square outline of the flange on the hat and the substrate.