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Conduction Cooling for Covered Circuit Cards Using Conducting Springs

IP.com Disclosure Number: IPCOM000058902D
Original Publication Date: 1988-Feb-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Buller, L Linam, S McNelis, B [+details]

Abstract

A method is disclosed for cooling covered circuit cards. Covered circuit cards present a unique problem for heat dissipation. The problem stems from the lack of airflow in and around the card because of the cover. This restricts heat transfer from modules to the card cover. Consequently, any airflow outside of the card covers will not be useful in dissipating the heat within the card cover.