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Pinless Module Connector System Disclosure Number: IPCOM000058922D
Original Publication Date: 1988-Feb-01
Included in the Prior Art Database: 2005-Feb-15

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Related People

Desai, K Petrozello, J [+details]


Input/Output (I/O) pads of a circuit module are formed on the bottom surface of a module's substrate, such as a ceramic chip carrier, by an array of inclined metallic pads, which mate with a corresponding array of contact springs mounted on a PC board. Contact wipe is affected by an actuation mechanism which provides relative movement between the card and module.