Pinless Module Connector System
Original Publication Date: 1988-Feb-01
Included in the Prior Art Database: 2005-Feb-15
Input/Output (I/O) pads of a circuit module are formed on the bottom surface of a module's substrate, such as a ceramic chip carrier, by an array of inclined metallic pads, which mate with a corresponding array of contact springs mounted on a PC board. Contact wipe is affected by an actuation mechanism which provides relative movement between the card and module.