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Process for Fabricating Printed Circuit Boards With Chips Mounted On Both Sides

IP.com Disclosure Number: IPCOM000058935D
Original Publication Date: 1988-Feb-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Leas, J [+details]

Abstract

This article describes a process for mounting chips on both sides of a printed circuit board. A major problem associated with this concept is that chips with solder ball contacts cannot simultaneously be mounted on both sides and reflowed, nor can chips be mounted on one side after the other without concern about losing contacts to chips on the first side. The following is a process which solves this problem and has the advantage of allowing testing of each side separately.